
Patent for automatic flipping device for CNC lathe processing promotes new progress in intelligent manufacturing
The automatic flipping device realizes a fast and efficient flipping process through advanced mechanical design and control technology, and can be easily integrated into the existing CNC lathe system.

Breakthroughs in Key CNC Machine Tool Technologies Achieved
my country's CNC machine tools have made breakthroughs in key core technologies and formed a number of iconic products. In the aviation field, we have independently developed heavy forging equipment such as 800MN large die forging presses and 120MN aluminum alloy plate tension stretching machines, filling the gap in the overall forming technology of large key parts in the domestic aviation field, and providing a strong guarantee for the cross-generational development of military aircraft and the development of large aircraft.

Precision Breakthrough: New Kovar Machining Solutions Target Amphenol's $80M Sealing Loss Crisis
Amphenol 2023 Annual Report (Page 34) discloses $80M in losses from connector sealing failures – a vulnerability compromising mission-critical systems across defense and 5G networks. With aerospace hermetic yields at 76.2% (below NASA-STD-6002) and thermal distortion plaguing high-power RF connectors, the industry demands radical solutions.

CNC processing technology continues to empower the construction of a modern industrial system
On March 11, 2025, the Third Session of the 14th National People's Congress voted to pass the resolution on the implementation of the 2024 National Economic and Social Development Plan and the 2025 National Economic and Social Development Plan, approving the 2025 National Economic and Social Development Plan.

Lumentum's technology path is upgraded again: photonic integration + 3D sensing subverts the global optical communication and medical track
With the explosive growth of global 5G, AI computing power and minimally invasive medical equipment, optical solutions with "ultra-precision, high reliability and miniaturization" have become the key to the industry's speed race.

Materion deepens cooperation with global material innovators to break through the technical bottleneck of next-generation semiconductor and aerospace materials
As the trend of semiconductor miniaturization and aerospace lightweighting accelerates, the reliability and functional requirements of high-performance materials continue to rise.

CONNECTORS DEMAND NANO-SCALE KOVAR: HOW NEXT-GEN MACHINING UNLOCKS THERMAL IMMORTALITY
Monterey dust still clings to connectors inside NASA’s Perseverance rover as it drills into Jezero Crater – a silent stress test no earthly lab can replicate. Glenair’s QPod™ micro-shells survived this inferno because thermal expansion control stopped being a feature and became religion.

Unlock the code of future smart factories

Sunkye joins hands with strategic partners to break through the connection problem between deep sea and new energy, and build a new paradigm of high-reliability sealing technology
Driven by the global energy transformation and the accelerated development of the marine economy, the sealing of equipment in extreme environments has become the core pain point of industrial connectors.

Breaking the Thermal Barrier: Kovar™ Hermetic Packages Enable Quantum Leap in 5G MM-Wave & Space Tech
Extreme environment testing at JPL confirms Sunkye Electronics' Kovar (Fe/Ni/Co 54/29/17) TO-8 packages maintained ≤2×10⁻¹¹ atm·cc/s helium leak rates after 5,000 thermal cycles (-196°C/+200°C) — surpassing MIL-STD-883H Method 1014.9 requirements by 400%. This breakthrough in Coefficient of Thermal Expansion (CTE) engineered glass-to-metal seals (GTMS) solves signal degradation in photonics and RF systems facing brutal thermal gradients










